MPE-3U (Multi-Platform Enclosure) 
(configurable base product)
PLATFORMS
Ground Vehicles
Unmanned Aerial Systems (UAS)
Rotor Wing Aircraft
The SprayCool MPE-3U is a small, lightweight, rugged, high performance direct-spray enclosure. Designed to provide unparalleled flexibility, the MPE 3U can enable survivability for both commercial grade and rugged electronics in harsh military environment applications. Capable of protecting both commercial grade or rugged electronics, the MPE-3U is truly versatile, in a small, light and cost effective format.
Using its patented direct spray evaporative technology, electronics are protected in the MPE’s sealed closed-loop environment, ensuring electronics survivability in extreme operating environments, encompassing both temperature and vibration. Architected to reduce non-recurring engineering expenses for custom products, the MPE-3U can be delivered in any payload configuration without mission-specific development.
Leveraging open industry standards and common commercial grade electronics, the MPE 3U enclosure can allow customers to quickly field common applications without redesign or re-qualification across a broad range of vehicle types and applications. The MPE enclosure (also available in a 6U model) offers a new standard of scalable thermal performance, environmental isolation and flexible design, that simplifies integration while meeting today’s and tomorrow’s customer needs in harsh environments.
Features
- Scalable: from 4 to 21 user slots, 6U or 3U
- Power Consumption: 80W maximum (for cooling system)
- Input Power: MIL-STD-704 and 1275B
- Backplanes: VME/VME-64X, cPCI/CPCIe, VXS, VPX
- Rugged: MIL-STD-810F, 461 and 462;
Alt:* up to 55,000 ft Temp:** -55° C to +71° C
*75,000 ft optional **-65° C optional
Benefits
- Flexibility: Ability to mix commercial cards with custom/rugged electronics, significantly reducing integration risk, time and costs
- Environmental Isolation: Enables electronics survivability in any environment. Does not require additional ECS capacity
- System Cost/Lifecycle Cost: Lowest system cost and life-cycle cost compared to conduction or other liquid alternatives
- Scalable – meets various electronics payload requirements
- Electronics Density: Enables highest electronics density available at extreme environments
- Reliability: Enables highest electronics reliability and survivability
- Rugged: Capable of operating in tactical environments
- SWaP: Minimize size, weight and power (SWaP) consumption
